2018-11-12
近日,泰凌微電子向Zigbee聯盟提交申請,自2018年11月起升級為參與者成員(Participant Member)。
泰凌微電子加入Zigbee聯盟多年,同時也是Zigbee聯盟中國成員組(ZMGC)的成員,一直致力于無線物聯網芯片的研發和設計,擁有一系列完整的高集成低功耗無線芯片,工作模式包括多模、Zigbee、藍牙低功耗、藍牙mesh、6LoWPAN/Thread、HomeKit、ANT、2.4G專有等行業主流標準協議。泰凌微電子的兼容平臺也通過了最新的Zigbee認證,全方位支持Zigbee 3.0協議并具備Green Power功能。
Telink有兩顆多模物聯網無線芯片可用于Zigbee市場
|
TLSR8258 |
TLSR8269 |
Supported Standard |
Zigbee 3.0 / RF4CE 6LoWPAN / Thread Bluetooth LE 5.0 / Bluetooth Mesh / HomeKit |
Zigbee 3.0 / RF4CE 6LoWPAN / Thread Bluetooth LE 5.0 / Bluetooth Mesh / HomeKit |
MCU |
32bit, up to 48MHz |
32bit, up to 48MHz |
SRAM |
64KB |
32KB |
Flash |
512KB |
512KB |
Built-in Clock |
Embedded 32kHz / 24MHz |
Embedded 32kHz / 32MHz |
Tx |
+10dBm |
+7dBm |
Rx |
-96dBm@BLE 1Mbps -99.5dBm@Zigbee 250kbps -93dBm@BLE 2Mbps -99dBm@BLE 500kbps -101dBm@BLE 125kbps |
-92dBm@BLE 1Mbps -97dBm@Zigbee 250Kbps -88dBm@2.4G proprietary 2Mbps |
Built-in Power |
LDO & DCDC |
LDO |
Power Supply |
1.8V ~ 3.6V |
1.9V ~ 3.6V |
Power Consumption |
5.3mA@Rx_fullchip 5.4mA@Tx 0dBm_fullchip <1uA@sleep+SRAM 0.4uA@sleep |
12mA@Rx_transceiver 15mA@Tx0dBm_transceiver 10uA@suspend(SRAM) 1.7uA@deepsleep(IO_Wakeup) |
GPIOs |
32 / 17 |
36 / 21 |
A rich set of I/Os |
DMIC AMIC I2S Stereo Audio SPI I2C UART USB SW 7816 Protocol |
DMIC AMIC Mono Audio SPI I2C UART USB SW |
PWM |
6 |
6 |
ADC |
14 |
14 |
Package |
QFN48 / QFN32 |
QFN48 / QFN32 |
Operating Temperature |
-40 ~ +125℃ |
-40 ~ +125℃ |
目前,泰凌微電子的Zigbee芯片已成功在若干重點客戶實現量產