eASIC Nextreme-3? is eASIC’s fourth generation eASIC Platform manufactured on a 28 nm CMOS process. The eASIC Nextreme-3 family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow and rapid delivery of prototype devices. eASIC Nextreme-3 Platforms come with an enhanced architecture that offers twice the performance and half of the power consumption of eASIC Nextreme-2? (eASIC’s 45 nm Platforms).

Key Features

• TSMC 28nm HP process with core operating voltage of 0.85 V
• Up to 80% lower power than FPGAs
• Up to twice the performance of 28 nm FPGAs
• Instant on – No SRAM cells for configuration avoiding SEU CRAM
• Up to 1.3M eCELLS (18M equivalent ASIC gates)
• Up to 56 Mbits of embedded memory blocks (bRAMS) with Built-In-Self Repair
• 800 MHz fine grained 9K bits memory blocks
• Embedded one bit fast adders for high-speed arithmetic and DSP functions
• Multi-gigabit I/O with speeds up to 12.5 Gbps
• New enhanced clocking structure with 36 global clock trees
• GreenPowerVia disables power to unused logic
• Support for 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.35 V and 1.2 V IO standards
• eFUSE for traceability and storing special keys
• Temperature sensing diode
• FPGA like design tools and flow

Devices Overview

* custom packages are also an option